Structural Black Electronics Hot Glue Coil Reactive Hot Melt Adhesives PUR-8830H

Factory Made Electrical Structural Bonding Hot Melt Adhesives PUR-8830H

Wanli® PUR hot melt adhesive PUR-8830H for electronics structural bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. PUR-8830H can be used for self-adhesion and mutual adhesion of PC, ABS, PVC and other plastics and aluminum, stainless steel and other metals. PUR-8830H is featured stable viscosity under heating at a certain temperature, high initial bonding strength and final bonding strength. After curing, PUR-8830H has good peeling strength, good heat&humidity resistance and chemical resistance. PUR-8830H is especially suitable for bonding applications in the electronics industry.

APPLICATION
Wanli® PUR hot melt adhesive PUR-8830H is used for electronic structural bonding. PUR-8830H can be used for self-adhesive and inter-adhesive bonding of plastics such as PC, ABS, PVC and metals such as aluminum and stainless steel. PUR-8830H is especially suitable for bonding applications in the electronics industry.

FEATURE
Stable viscosity under heating at a certain temperature.
High initial bonding strength and final bonding strength.
With good peeling strength, good heat&humidity resistance and chemical resistance after curing.

USER GUIDE
The package of PUR-8830H is suitable for various dispensing equipment.
Recommended working temperature is about 110℃.
In order to achieve complete curing, it is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 65% relative humidity).

STORAGE
Store in a dry, cool place and avoid di rect sunlight. Storage temperature should not exceed 35℃, avoid open flame or heat source.

structural electronics hot glue

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Coil reactive hot melt adhesives

Structural Black Electronics Hot Glue Coil Reactive Hot Melt Adhesives PUR-8830H Images